| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-43-424-61-003000CONN IC SKT DBL |
3,659 | - |
|
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
116-43-624-61-003000CONN IC SKT DBL |
3,321 | - |
|
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
116-93-324-61-003000CONN IC SKT DBL |
3,625 | - |
|
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
116-93-424-61-003000CONN IC SKT DBL |
2,162 | - |
|
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
116-93-624-61-003000CONN IC SKT DBL |
3,936 | - |
|
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
127-93-668-41-002000CONN IC DIP SOCKET 68POS GOLD |
3,470 | - |
|
Datasheet |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
127-43-668-41-002000CONN IC SKT DBL |
3,795 | - |
|
Datasheet |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
326-93-164-41-001000CONN SOCKET SIP 64POS GOLD |
3,461 | - |
|
Datasheet |
Tube | 326 | Active | SIP | 64 (1 x 64) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
126-93-650-41-003000CONN IC DIP SOCKET 50POS GOLD |
2,691 | - |
|
Datasheet |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
126-93-950-41-003000CONN IC DIP SOCKET 50POS GOLD |
2,412 | - |
|
Datasheet |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
126-43-650-41-003000CONN IC SKT DBL |
3,987 | - |
|
Datasheet |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
126-43-950-41-003000CONN IC SKT DBL |
2,699 | - |
|
Datasheet |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
612-41-964-41-004000SKT CARRIER SOLDRTL |
3,532 | - |
|
Datasheet |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
612-91-964-41-004000SKT CARRIER SOLDRTL |
3,563 | - |
|
Datasheet |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
127-41-668-41-003000CONN IC SKT DBL |
2,729 | - |
|
Datasheet |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
127-91-668-41-003000CONN IC SKT DBL |
3,471 | - |
|
Datasheet |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
116-93-950-41-001000CONN IC DIP SOCKET 50POS GOLD |
3,167 | - |
|
Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
116-43-950-41-001000CONN IC SKT DBL |
3,421 | - |
|
Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-41-950-61-001000CONN IC SKT DBL |
3,606 | - |
|
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
110-91-950-61-001000CONN IC SKT DBL |
3,768 | - |
|
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |